Hunhu hwakanaka Emi Copper Foil Shielding Tape - EMI Shielding Firimu rine Good Shielding - Lucky Innovative
Hunhu hwakanaka Emi Copper Foil Shielding Tape - EMI Shielding Firimu rine Good Shielding - Lucky Innovative
Hunhu hwakanaka Emi Copper Foil Shielding Tape - EMI Shielding Firimu Rine Kudzivirira Kwakanaka - Lucky Innovative Detail:
Product Description
EMI Shielding Firimu rinonyanya kushandiswa muFPC iyo ine maModules enharembozha, PC, mishonga yekurapa, kamera dzedhijitari, zviridzwa zvemotokari, nezvimwe.
Product Kuwanikwa
LKES-800
LKES-1000
LEKS-6000
Product Features
(1) Hunhu hwakanaka hwekugadzirisa
(2) Kufambisa zvakanaka kwemagetsi
(3) Zvinhu zvakanaka zvekudzivirira
(4) Zvakanaka kupisa kupisa
(5) Yakasununguka nharaunda (Halogen yemahara, inosangana nezvinodiwa zveRoHS Directives uye REACH, nezvimwewo)
Chigadzirwa Chimiro
Product Characteristics
LKES -800
| Item | Test Data | Test standard kana Test nzira |
| Hukobvu (Pamberi peLamination, μm) | 16±10% | Enterprise Standard |
| Hukobvu (Mushure meLamination, μm) | 13±10% | Enterprise Standard |
| Ground Resistance (Goridhe yakaputirwa, φ 1.0mm, 1.0cm, Ω) | JIS C5016 1994-7.1 | |
| Kupenengura simba kwefirimu rakasimbiswa (N/25mm) | Enterprise Standard | |
| Lead-isina Soldering Reflow (MAX 265℃) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, 3 nguva) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Surface Resistance (mΩ/ □) | ＜350 | Four Terminal Method |
| Flame Retardant | VTM-0 | UL94 |
| Printing Character | PASS | JIS K5600 |
| Kubwinya(60°, Gs) | ＜20 | GB9754-88 |
| Kemikari kuramba (Acid, alkali uye OSP) | PASS | JIS C6471 1995-9.2 |
| Kunamatira kune Stiffener (N / cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Item | Test Data | Test standard kana Test nzira |
| Hukobvu (Mushure meLamination, μm) | 14-18 | Enterprise Standard |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Surface Insulation | ≥200 | Enterprise Standard |
| Adhesive Fastness (Mazana masero bvunzo) | Hapana sero rinodonha | JIS C 6471 1995-8.1 |
| Kuramba Doro Kupukuta | 50 nguva hapana kukanganisa | Enterprise Standard |
| Scratch Resistance | 5 nguva hapana Leakage yesimbi | Enterprise Standard |
| Ground Resistance, (Goridhe plating, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| Lead-isina Soldering Reflow (MAX 265℃) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, 3 nguva) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Printing Character | PASS | JIS K5600 |
LKES-6000
| Item | Test Data | Test standard kana Test nzira |
| Hukobvu (Mushure meLamination, μm) | 13±10% | Enterprise Standard |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ground Resistance, (Ndarama yakanamirwa, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ground Resistance, (Ndarama yakanamirwa, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Simba rekuburitsa (N/cm) | Enterprise Standard | |
| Surface Insulation (mΩ) | ≥200 | Enterprise Standard |
| Adhesive Fastness (Mazana maseru bvunzo) | Hapana sero rinodonha | JIS C 6471 1995-8.1 |
| Lead-isina Soldering Reflow (MAX 265℃) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, 3 nguva) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Flame Retardant | VTM-0 | UL94 |
| Printing Character | PASS | JIS K5600 |
Recommended Processing Condition
| Lamination Method | Lamination mamiriro | Solidification mamiriro | |||
| Tembiricha (℃) | Pressure(kg) | Nguva (s) | Tembiricha (℃) | Nguva(min) | |
| Kurumidza- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Ongorora: Mutengi anogona kugadzirisa tekinoroji zvichienderana nemamiriro chaiwo kana uchigadzira.
(1) Bvisa chidziviriro chekutanga, uye wozobatanidza kuFPC, 80 ℃ tafura yekudziya inogona kushandiswa kumberi kwekubatanidza.
(2) Laminate maererano nemaitiro ari pamusoro, bvisa, uye wobva wabvisa firimu rekutakura mushure mekutonhora.
(3) Solidification maitiro.
Packing
(1) Standard Tsanangudzo yechigadzirwa: 250mm×100m.
(2) Mushure mekubvisa static magetsi, zvigadzirwa zvakarongedzwa mualuminium foil bepa uye zvakare kuisa yakaoma mukati mayo.
(3) Kunze kwakazara mumakatoni emapepa uye yakagadziriswa kuti ive nechokwadi chekuchengetedza zvigadzirwa panguva yekufambisa nekubata, uye kudzivirira kukuvara.
Kuchengeta uye Kuteerera
(1) Yakakurudzirwa Storage Condition
Tembiricha: (0-10)℃; Humidity: pasi pe70% RH
(2) Attention
(2.1) Ndokumbira usavhure pasuru yekunze uye udzikamise firimu rekudzivirira pane tembiricha yemaawa 6 usati washandisa kuderedza mhedzisiro yechando nedova pafirimu rekudzivirira.
(2.2) Ratidza kuti rishandiswe nekukurumidza mushure mekutora kubva munzvimbo inotonhora, kana kunaka kuchichinja pasi petembiricha yakajairwa kwenguva yakareba.
(2.3) Ichi chigadzirwa hachimiri kumvura chikamu chekuisa chisimbiso mumiriri uye flux, kana uine iyo yepamusoro yekugadzirisa tekinoroji, ndapota edza uye simbisa kutanga.
(2.4) Ratidza kukurumidza lamination, vacuum laminating inoda kuongororwa nekusimbiswa.
(2.5) Hunhu vimbiso nguva pasi pemamiriro ari pamusoro ndeye 6 mwedzi.
Mifananidzo yezvigadzirwa:
Related Product Guide:
Isu tinopawo makambani ekutsvagisa uye ekubatanidza ndege. Isu ikozvino tine yedu chaiyo yekugadzira nzvimbo uye bhizinesi rekutsvaga. Tinogona kukupa nemhando dzese dzechigadzirwa chakakodzera kune yedu mhinduro array yeYakanaka mhando Emi Copper Foil Shielding Tape - EMI Shielding Firimu ine Yakanaka Shielding - Lucky Innovative , Chigadzirwa chinozopa kupasirese nyika, senge: moldova, New Delhi, Belgium, Isu tinovavarira kugona, kuvandudza nguva dzose uye hunyanzvi, "injiniya" inozvipira kuita sarudzo yeinjiniya. brand" suppliers. Sarudza isu, kugovera kukunda-kukunda mamiriro!
NaBeulah kubva kuNetherlands - 2017.07.07 13:00 Iyo kambani inoteerana nekondirakiti yakasimba, mugadziri ane mukurumbira, anokodzera kushandira pamwe kwenguva refu.
NaChris Fountas kubva kuCologne - 2017.03.07 13:42 -
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