Zvitsva Zvitsva Zvitsva Emi Rfi Shielding Tape - EMI Shielding Firimu rine Good Shielding – Lucky Innovative
Zvitsva Zvitsva Zvitsva Emi Rfi Shielding Tape - EMI Shielding Firimu rine Good Shielding – Lucky Innovative
Zvitsva Zvitsva Zvitsva Emi Rfi Shielding Tape - EMI Shielding Firimu Rine Kudzivirira Kwakanaka – Lucky Innovative Detail:
Product Description
EMI Shielding Firimu rinonyanya kushandiswa muFPC iyo ine maModules enharembozha, PC, mishonga yekurapa, kamera dzedhijitari, zviridzwa zvemotokari, nezvimwe.
Product Kuwanikwa
LKES-800
LKES-1000
LEKS-6000
Product Features
(1) Hunhu hwakanaka hwekugadzirisa
(2) Kufambisa zvakanaka kwemagetsi
(3) Zvinhu zvakanaka zvekudzivirira
(4) Zvakanaka kupisa kupisa
(5) Yakasununguka nharaunda (Halogen yemahara, inosangana nezvinodiwa zveRoHS Directives uye REACH, nezvimwewo)
Chigadzirwa Chimiro
Product Characteristics
LKES -800
| Item | Test Data | Test standard kana Test nzira |
| Hukobvu (Pamberi peLamination, μm) | 16±10% | Enterprise Standard |
| Hukobvu (Mushure meLamination, μm) | 13±10% | Enterprise Standard |
| Ground Resistance (Goridhe yakaputirwa, φ 1.0mm, 1.0cm, Ω) | JIS C5016 1994-7.1 | |
| Kupenengura simba kwefirimu rakasimbiswa (N/25mm) | Enterprise Standard | |
| Lead-isina Soldering Reflow (MAX 265℃) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, 3 nguva) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Surface Resistance (mΩ/ □) | ＜350 | Four Terminal Method |
| Flame Retardant | VTM-0 | UL94 |
| Printing Character | PASS | JIS K5600 |
| Kubwinya(60°, Gs) | ＜20 | GB9754-88 |
| Kemikari kuramba (Acid, alkali uye OSP) | PASS | JIS C6471 1995-9.2 |
| Kunamatira kune Stiffener (N / cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Item | Test Data | Test standard kana Test nzira |
| Hukobvu (Mushure meLamination, μm) | 14-18 | Enterprise Standard |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Surface Insulation | ≥200 | Enterprise Standard |
| Adhesive Fastness (Mazana masero bvunzo) | Hapana sero rinodonha | JIS C 6471 1995-8.1 |
| Kuramba Doro Kupukuta | 50 nguva hapana kukanganisa | Enterprise Standard |
| Scratch Resistance | 5 nguva hapana Leakage yesimbi | Enterprise Standard |
| Ground Resistance, (Goridhe plating, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| Lead-isina Soldering Reflow (MAX 265℃) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, 3 nguva) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Printing Character | PASS | JIS K5600 |
LKES-6000
| Item | Test Data | Test standard kana Test nzira |
| Hukobvu (Mushure meLamination, μm) | 13±10% | Enterprise Standard |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ground Resistance, (Ndarama yakanamirwa, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ground Resistance, (Ndarama yakanamirwa, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Simba rekuburitsa (N/cm) | Enterprise Standard | |
| Surface Insulation (mΩ) | ≥200 | Enterprise Standard |
| Adhesive Fastness (Mazana maseru bvunzo) | Hapana sero rinodonha | JIS C 6471 1995-8.1 |
| Lead-isina Soldering Reflow (MAX 265℃) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, 3 nguva) | Hapana stratification; Hapana kupupa furo | JIS C6471 1995-9.3 |
| Flame Retardant | VTM-0 | UL94 |
| Printing Character | PASS | JIS K5600 |
Recommended Processing Condition
| Lamination Method | Lamination mamiriro | Solidification mamiriro | |||
| Tembiricha (℃) | Pressure(kg) | Nguva (s) | Tembiricha (℃) | Nguva(min) | |
| Kurumidza- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Ongorora: Mutengi anogona kugadzirisa tekinoroji zvichienderana nemamiriro chaiwo kana uchigadzira.
(1) Bvisa chidziviriro chekutanga, uye wozobatanidza kuFPC, 80 ℃ tafura yekudziya inogona kushandiswa kumberi kwekubatanidza.
(2) Laminate maererano nemaitiro ari pamusoro, bvisa, uye wobva wabvisa firimu rekutakura mushure mekutonhora.
(3) Solidification maitiro.
Packing
(1) Standard Tsanangudzo yechigadzirwa: 250mm×100m.
(2) Mushure mekubvisa static magetsi, zvigadzirwa zvakarongedzwa mualuminium foil bepa uye zvakare kuisa yakaoma mukati mayo.
(3) Kunze kwakazara mumakatoni emapepa uye yakagadziriswa kuti ive nechokwadi chekuchengetedza zvigadzirwa panguva yekufambisa nekubata, uye kudzivirira kukuvara.
Kuchengeta uye Kuteerera
(1) Yakakurudzirwa Storage Condition
Tembiricha: (0-10)℃; Humidity: pasi pe70% RH
(2) Attention
(2.1) Ndokumbira usavhure pasuru yekunze uye udzikamise firimu rekudzivirira pane tembiricha yemaawa 6 usati washandisa kuderedza mhedzisiro yechando nedova pafirimu rekudzivirira.
(2.2) Ratidza kuti rishandiswe nekukurumidza mushure mekutora kubva munzvimbo inotonhora, kana kunaka kuchichinja pasi petembiricha yakajairwa kwenguva yakareba.
(2.3) Ichi chigadzirwa hachimiri kumvura chikamu chekuisa chisimbiso mumiriri uye flux, kana uine iyo yepamusoro yekugadzirisa tekinoroji, ndapota edza uye simbisa kutanga.
(2.4) Ratidza kukurumidza lamination, vacuum laminating inoda kuongororwa nekusimbiswa.
(2.5) Hunhu vimbiso nguva pasi pemamiriro ari pamusoro ndeye 6 mwedzi.
Mifananidzo yezvigadzirwa:
Related Product Guide:
Inogona kuva nzira yakanaka yekusimudzira mhinduro dzedu uye sevhisi. Basa redu raizova rekuvaka zvigadzirwa zvevatengi vane ruzivo rwepamusoro rwekushanda kweHot New Products Emi Rfi Shielding Tape - EMI Shielding Firimu neGood Shielding - Lucky Innovative , Chigadzirwa chacho chichapa pasi rose, se: Denmark , Detroit , Puerto Rico , Isu tinopawo OEM sevhisi inoenderana nezvido zvako uye zvaunoda. Nechikwata chakasimba chemainjiniya ane ruzivo mukugadzira hose uye kusimudzira, tinokoshesa mukana wega wega wekupa zvigadzirwa zvakanakisa uye mhinduro kune vatengi vedu.
NaClara anobva kuTunisia - 2017.08.18 11:04 Iyi kambani inogona kuita zvakanaka kuzadzisa zvatinoda pahuwandu hwechigadzirwa uye nguva yekuendesa, saka tinogara tichizvisarudza kana tine zvinodiwa zvekutenga.
NaHulda anobva kuYemen - 2017.05.02 11:33 -
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