Mugadziri weMhangura Tepi Emi Shielding - EMI Shielding Firimu rine Good Shielding

Mugadziri weMhangura Tepi Emi Shielding - EMI Shielding Firimu rine Good Shielding – Lucky Innovative

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Isu tinonamatira nedzidziso ye "mhando yekutanga, kambani kutanga, yakatsiga kuvandudza uye hunyanzvi hwekugutsa vatengi" kune manejimendi uye "zero kukanganisa, zero zvichemo" sechinangwa chemhando. Kuti tikwanise mupi wedu, isu tinoendesa zvinhu pamwe chete nemhando yakanaka yakanaka pamutengo unonzwisisika weBlank Magnetic Stripe Cards,Transparent Emi Shielding Firimu,Magnetic Card, Nebasa repamusoro uye mhando, uye bhizinesi rekutengeserana kunze kwenyika rine chokwadi uye kukwikwidza, iro richavimbwa uye rinogamuchirwa nevatengi varo uye rinogadzira mufaro kune vashandi varo.

Mugadziri weCopper Tape Emi Shielding - EMI Shielding Firimu Rine Kudzivirira Kwakanaka – Lucky Innovative Detail:

Product Description

EMI Shielding Firimu rinonyanya kushandiswa muFPC iyo ine maModules enharembozha, PC, mishonga yekurapa, kamera dzedhijitari, zviridzwa zvemotokari, nezvimwe.

Product Kuwanikwa

LKES-800
LKES-1000
LEKS-6000

Product Features

(1) Hunhu hwakanaka hwekugadzirisa
(2) Kufambisa zvakanaka kwemagetsi
(3) Zvinhu zvakanaka zvekudzivirira
(4) Zvakanaka kupisa kupisa
(5) Yakasununguka nharaunda (Halogen yemahara, inosangana nezvinodiwa zveRoHS Directives uye REACH, nezvimwewo)

Chigadzirwa Chimiro

Dry film

Product Characteristics

LKES -800

Item	Test Data	Test standard kana Test nzira
Hukobvu (Pamberi peLamination, μm)	16±10%	Enterprise Standard
Hukobvu (Mushure meLamination, μm)	13±10%	Enterprise Standard
Ground Resistance (Goridhe yakaputirwa, φ 1.0mm, 1.0cm, Ω)		JIS C5016 1994-7.1
Kupenengura simba kwefirimu rakasimbiswa (N/25mm)		Enterprise Standard
Lead-isina Soldering Reflow (MAX 265℃)	Hapana stratification; Hapana kupupa furo	JIS C6471 1995-9.3
Solder (288 ℃, 10s, 3 nguva)	Hapana stratification; Hapana kupupa furo	JIS C6471 1995-9.3
Shielding Properties(dB)	>50	GB/T 30142-2013
Surface Resistance (mΩ/ □)	＜350	Four Terminal Method
Flame Retardant	VTM-0	UL94
Printing Character	PASS	JIS K5600
Kubwinya(60°, Gs)	＜20	GB9754-88
Kemikari kuramba (Acid, alkali uye OSP)	PASS	JIS C6471 1995-9.2
Kunamatira kune Stiffener (N / cm)	＞4	IPC-TM-650 2.4.9

LKES-1000

Item	Test Data	Test standard kana Test nzira
Hukobvu (Mushure meLamination, μm)	14-18	Enterprise Standard
Shielding Properties(dB)	≥50	GB/T 30142-2013
Surface Insulation	≥200	Enterprise Standard
Adhesive Fastness (Mazana masero bvunzo)	Hapana sero rinodonha	JIS C 6471 1995-8.1
Kuramba Doro Kupukuta	50 nguva hapana kukanganisa	Enterprise Standard
Scratch Resistance	5 nguva hapana Leakage yesimbi	Enterprise Standard
Ground Resistance, (Goridhe plating, φ 1.0mm, 1.0cm, Ω)	≤1.0	JIS C5016 1994-7.1
Lead-isina Soldering Reflow (MAX 265℃)	Hapana stratification; Hapana kupupa furo	JIS C6471 1995-9.3
Solder (288 ℃, 10s, 3 nguva)	Hapana stratification; Hapana kupupa furo	JIS C6471 1995-9.3
Printing Character	PASS	JIS K5600

LKES-6000

Item	Test Data	Test standard kana Test nzira
Hukobvu (Mushure meLamination, μm)	13±10%	Enterprise Standard
Shielding Properties(dB)	≥50	GB/T 30142-2013
Ground Resistance, (Ndarama yakanamirwa, φ 1.0mm, 1.0cm, Ω)	≤0.5	JIS C5016 1994-7.1
Ground Resistance, (Ndarama yakanamirwa, φ 1.0mm, 3.0cm, Ω)	0.20	JIS C5016 1994-7.1
Simba rekuburitsa (N/cm)		Enterprise Standard
Surface Insulation (mΩ)	≥200	Enterprise Standard
Adhesive Fastness (Mazana maseru bvunzo)	Hapana sero rinodonha	JIS C 6471 1995-8.1
Lead-isina Soldering Reflow (MAX 265℃)	Hapana stratification; Hapana kupupa furo	JIS C6471 1995-9.3
Solder (288 ℃, 10s, 3 nguva)	Hapana stratification; Hapana kupupa furo	JIS C6471 1995-9.3
Flame Retardant	VTM-0	UL94
Printing Character	PASS	JIS K5600

Recommended Processing Condition

Lamination Method	Lamination mamiriro			Solidification mamiriro
Lamination Method	Tembiricha (℃)	Pressure(kg)	Nguva (s)	Tembiricha (℃)	Nguva(min)
Kurumidza- Lamination	LKES800/6000:180±10LKES1000:175±5	100-120	80-120	160±10	30-60

Ongorora: Mutengi anogona kugadzirisa tekinoroji zvichienderana nemamiriro chaiwo kana uchigadzira.
(1) Bvisa chidziviriro chekutanga, uye wozobatanidza kuFPC, 80 ℃ tafura yekudziya inogona kushandiswa kumberi kwekubatanidza.
(2) Laminate maererano nemaitiro ari pamusoro, bvisa, uye wobva wabvisa firimu rekutakura mushure mekutonhora.
(3) Solidification maitiro.

Packing

(1) Standard Tsanangudzo yechigadzirwa: 250mm×100m.
(2) Mushure mekubvisa static magetsi, zvigadzirwa zvakarongedzwa mualuminium foil bepa uye zvakare kuisa yakaoma mukati mayo.
(3) Kunze kwakazara mumakatoni emapepa uye yakagadziriswa kuti ive nechokwadi chekuchengetedza zvigadzirwa panguva yekufambisa nekubata, uye kudzivirira kukuvara.

Kuchengeta uye Kuteerera

(1) Yakakurudzirwa Storage Condition
Tembiricha: (0-10)℃; Humidity: pasi pe70% RH
(2) Attention
(2.1) Ndokumbira usavhure pasuru yekunze uye udzikamise firimu rekudzivirira pane tembiricha yemaawa 6 usati washandisa kuderedza mhedzisiro yechando nedova pafirimu rekudzivirira.
(2.2) Ratidza kuti rishandiswe nekukurumidza mushure mekutora kubva munzvimbo inotonhora, kana kunaka kuchichinja pasi petembiricha yakajairwa kwenguva yakareba.
(2.3) Ichi chigadzirwa hachimiri kumvura chikamu chekuisa chisimbiso mumiriri uye flux, kana uine iyo yepamusoro yekugadzirisa tekinoroji, ndapota edza uye simbisa kutanga.
(2.4) Ratidza kukurumidza lamination, vacuum laminating inoda kuongororwa nekusimbiswa.
(2.5) Hunhu vimbiso nguva pasi pemamiriro ari pamusoro ndeye 6 mwedzi.